Konstantis Daloukas is a director in the R&D team in Ansys, where he is leading the technical efforts for the design and development of novel and high-performance algorithms and methodologies for multi-physics simulation and sign-off of large-scale integrated circuits. Before joining Ansys in 2019, he was a member of the R&D team in Helic, developing software for the electromagnetic analysis of integrated circuits. Konstantis holds a Ph.D. in Electrical and Computer Engineering from the University of Thessaly, is an author of numerous publications, and holds 7 US patents.
EDA and Computational Software in an All-Connected, Intelligent World: Challenges and Opportunities
As technology continues to evolve at a pace not seen before, the EDA industry is faced with new challenges that require innovative solutions. The need for pervasive connectivity, the increased data rates in hyperscalers, and the advancement in AI/ML algorithms have led to the need for bespoke 3D silicon chips. Those chips have unique needs for analysis and verification that extend beyond the massive capacity of EDA tools. In addition, the rise of artificial intelligence presents significant opportunities for the EDA industry. AI can automate various aspects of the chip design process, improve the accuracy and efficiency of simulation and testing, and ultimately ensure the reliability and quality of chips. However, AI-specific integrated circuits present unique challenges due to their enormous size and complexity.
In this presentation, we will discuss the landscape for EDA, present the unprecedented challenges
as well as the opportunities for developing new and advanced EDA tools that are capable of meeting
the demands of the ever-changing semiconductor industry while ensuring that the chips we design are safe, reliable, and of the highest quality.
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